A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards Suitable for LAN, WAN, telecommunication, PC and workstation applications Shrouded leaf design (minimises damaging header contacts) Low insertion force sockets High-temperature LCP housing for use with reflow solder processes Antiflux design Mated heights: 8 → 15mm (see combination guide)
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards Suitable for LAN, WAN, telecommunication, PC and workstation applications Shrouded leaf design (minimises damaging header contacts) Low insertion force sockets High-temperature LCP housing for use with reflow solder processes Antiflux design Mated heights: 8 → 15mm (see combination guide)