Samtec SEAF Series Straight Surface Mount PCB Socket, 320-Contact, 8-Row, 1.27mm Pitch, Solder Termination
- RS Stock No.:
- 180-2617P
- Mfr. Part No.:
- SEAF-40-05.0-S-08-2-A-K-TR
- Brand:
- Samtec
Bulk discount available
Subtotal 10 units (supplied on a continuous strip)*
£157.90
(exc. VAT)
£189.50
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- Plus 2 unit(s) shipping from 13 October 2025
- Plus 999,999,997 unit(s) shipping from 03 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 10 - 49 | £15.79 |
| 50 - 99 | £15.36 |
| 100 - 249 | £14.95 |
| 250 + | £14.58 |
*price indicative
- RS Stock No.:
- 180-2617P
- Mfr. Part No.:
- SEAF-40-05.0-S-08-2-A-K-TR
- Brand:
- Samtec
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Number of Contacts | 320 | |
| Number of Rows | 8 | |
| Pitch | 1.27mm | |
| Type | High-Speed High-Density Open-Pin-Field Array Socket | |
| Mounting Type | Surface Mount | |
| Body Orientation | Straight | |
| Termination Method | Solder | |
| Current Rating | 2.7A | |
| Voltage Rating | 240 V | |
| Series | SEAF | |
| Contact Material | Copper | |
Select all | ||
|---|---|---|
Brand Samtec | ||
Number of Contacts 320 | ||
Number of Rows 8 | ||
Pitch 1.27mm | ||
Type High-Speed High-Density Open-Pin-Field Array Socket | ||
Mounting Type Surface Mount | ||
Body Orientation Straight | ||
Termination Method Solder | ||
Current Rating 2.7A | ||
Voltage Rating 240 V | ||
Series SEAF | ||
Contact Material Copper | ||
- COO (Country of Origin):
- CR
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.
Up to 500 I/Os
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Lower insertion/withdrawal forces
Solder charge termination
7 mm - 17.5 mm stack heights
Dual sourced by Molex®
Samtec 28+ Gbps Solution
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Lower insertion/withdrawal forces
Solder charge termination
7 mm - 17.5 mm stack heights
Dual sourced by Molex®
Samtec 28+ Gbps Solution