Molex Micro-Fit+ Series Vertical Through Hole PCB Header, 20 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

This PCB header is designed for high-performance applications in the electronics and automation industries. The product features a 3.0mm pitch, dual-row configuration with 20 circuits, ideal for connecting various components effectively. With a vertical mounting orientation and a shrouded design, it ensures secure and efficient connectivity in wire-to-board scenarios.

• High copper alloy contact material enhances conductivity and durability
• Gold plating improves corrosion resistance and ensures reliable connections
• Shrouded design prevents unintended contact for increased safety
• Supports a maximum current rating of 12A for high-power applications
• Through-hole design allows for secure and stable mounting
• Glow-wire capable, suitable for rigorous thermal conditions

• Used in power distribution systems connecting wires to PCBs
• Ideal for automation equipment requiring reliable electrical connections
• Suitable for electrical systems where space is limited and efficiency is a priority
• Employed in mechanical devices needing robust and stable connections

Each circuit supports a maximum current rating of 12.5A, accommodating various electrical demands in high-power applications.

The header is primarily constructed from a high copper alloy for the contact material, ensuring superior electrical performance. The resin is liquid crystal polymer, providing thermal stability and durability.

The glow-wire capability allows this component to resist ignition under elevated temperatures, making it suitable for applications where safety and thermal performance are crucial.

This component operates efficiently within a temperature range of -40°C to +105°C, making it versatile for various environments, including industrial applications.