Molex 70246 Series Vertical Through Hole Header, 8 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

Subtotal (1 tray of 300 units)*

£237.36

(exc. VAT)

£284.83

(inc. VAT)

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Tray(s)
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Per unit*
1 +£237.36£0.791

*price indicative

RS Stock No.:
694-028
Mfr. Part No.:
70246-0801
Brand:
Molex
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Brand

Molex

Series

70246

Product Type

Header

Current

2.5A

Pitch

2.54mm

Number of Contacts

8

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Plating

Gold

Contact Material

Bronze

Termination Type

Solder

Minimum Operating Temperature

-55°C

Tail Pin Length

3.43mm

Maximum Operating Temperature

120°C

Standards/Approvals

RoHS Compliant

Voltage

250V

COO (Country of Origin):
MY
The Molex C-Grid 2.54mm pitch header is expertly designed for reliability in PCB applications, delivering an optimal connection for signal and wire-to-board use. With its low-profile, dual-row, vertical configuration, this component accommodates up to 8 circuits, ensuring robust performance in demanding environments. Crafted with precision, the header features 0.38μm gold selective plating to enhance durability and conductivity. Active in status, it belongs to the 70246 series and is perfectly suited for various applications within the PCB headers and receptacles category. Ideal for engineers seeking dependable solutions, this header not only meets industry standards but also exemplifies exceptional quality and engineering excellence.

Constructed with a dual-row design for efficient space utilisation on PCBs

Achieves a maximum current of 2.5A per contact, suitable for high-performance applications

Voltage rating of up to 250V DC, ensuring versatility across various projects

No need for additional keying due to its non-polarised design, simplifying the mating process

Designed for through-hole termination style, facilitating easy installation on PCBs

Encased in a fully shrouded form to prevent accidental disconnections and improve safety

Compatible with both wave and lead-free solder processes, supporting modern assembly techniques

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