Molex 216571 Series Vertical Through Hole PCB Header, 3 Contact(s), 3mm Pitch, 1 Row(s), Shrouded
- RS Stock No.:
- 684-828
- Mfr. Part No.:
- 216571-3003
- Brand:
- Molex
Subtotal (1 tray of 120 units)*
£189.90
(exc. VAT)
£227.88
(inc. VAT)
Stock information currently inaccessible
Tray(s) | Per Tray | Per unit* |
---|---|---|
1 + | £189.90 | £1.583 |
*price indicative
- RS Stock No.:
- 684-828
- Mfr. Part No.:
- 216571-3003
- Brand:
- Molex
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Molex | |
Series | 216571 | |
Pitch | 3mm | |
Number of Contacts | 3 | |
Number of Rows | 1 | |
Body Orientation | Vertical | |
Shrouded/Unshrouded | Shrouded | |
Mounting Type | Through Hole | |
Select all | ||
---|---|---|
Brand Molex | ||
Series 216571 | ||
Pitch 3mm | ||
Number of Contacts 3 | ||
Number of Rows 1 | ||
Body Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mounting Type Through Hole | ||
- COO (Country of Origin):
- CN
The Molex Micro-Fit+ Vertical Header designed to facilitate efficient power and signal connections within various electronic applications. This robust header, with a 3.00mm pitch and three circuits, ensures reliable performance in demanding environments, thanks to its glow-wire capability. Constructed from high copper alloy and featuring a matte tin plated termination, it combines durability with excellent electrical characteristics. Operating over a temperature range of -40° to +125°C, this component is ideal for long-lasting connections. Its one-row design enhances space optimisation on PCBs, while features like PCB retention and compatibility with standard housings make it an essential choice for users aiming for reliability and efficiency in their wire-to-board connections.
Glow wire capable for enhanced safety in structural applications
Designed with a vertical orientation for compact PCB layouts
Robust one row, three circuit design maximises space efficiency
Constructed with high copper alloy for superior conductivity
Matte tin plating for improved solderability and corrosion resistance
Durability rating of 200 mating cycles ensures long term reliability
Utilises lead free solder process capability for eco friendly manufacturing
Locking features to mating parts enhance connection stability
Designed with a vertical orientation for compact PCB layouts
Robust one row, three circuit design maximises space efficiency
Constructed with high copper alloy for superior conductivity
Matte tin plating for improved solderability and corrosion resistance
Durability rating of 200 mating cycles ensures long term reliability
Utilises lead free solder process capability for eco friendly manufacturing
Locking features to mating parts enhance connection stability
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