Phoenix Contact MCDN Series Wave Soldering Mount PCB Header, 30 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded
- RS Stock No.:
- 557-504
- Mfr. Part No.:
- 1953334
- Brand:
- Phoenix Contact
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Stock information currently inaccessible
- RS Stock No.:
- 557-504
- Mfr. Part No.:
- 1953334
- Brand:
- Phoenix Contact
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Phoenix Contact | |
| Product Type | PCB Header | |
| Series | MCDN | |
| Current | 8A | |
| Pitch | 3.5mm | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 30 | |
| Number of Rows | 2 | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | COMBICON FMC 1.5 MCDN 1.5 | |
| Mount Type | Wave Soldering Mount | |
| Contact Plating | Tin Plated | |
| Contact Material | Copper Alloy | |
| Row Pitch | 3.5mm | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 100°C | |
| Tail Pin Length | 1.4mm | |
| Contact Gender | Male | |
| Mating Pin Length | 14mm | |
| Standards/Approvals | cULus E60425-20110128, VDE40011723 | |
| Voltage | 160V | |
| Select all | ||
|---|---|---|
Brand Phoenix Contact | ||
Product Type PCB Header | ||
Series MCDN | ||
Current 8A | ||
Pitch 3.5mm | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 30 | ||
Number of Rows 2 | ||
Shrouded/Unshrouded Shrouded | ||
Connector System COMBICON FMC 1.5 MCDN 1.5 | ||
Mount Type Wave Soldering Mount | ||
Contact Plating Tin Plated | ||
Contact Material Copper Alloy | ||
Row Pitch 3.5mm | ||
Minimum Operating Temperature -40°C | ||
Termination Type Solder | ||
Maximum Operating Temperature 100°C | ||
Tail Pin Length 1.4mm | ||
Contact Gender Male | ||
Mating Pin Length 14mm | ||
Standards/Approvals cULus E60425-20110128, VDE40011723 | ||
Voltage 160V | ||
- COO (Country of Origin):
- DE
The Phoenix Contact PCB header is a robust connector solution designed to enhance your electronic assemblies. Engineered for through hole reflow processes, this component caters to modern manufacturing needs with its versatile design. Featuring a Compact layout with a pitch of 3.5 mm, it supports high-density applications while ensuring reliable electrical connections. The black housing combines durability with excellent insulating properties, making it suitable for various environmental conditions. Its intuitive snap-in locking mechanism simplifies assembly, preventing accidental disconnections and ensuring reliable performance throughout its lifecycle.
Designed for integration into SMT soldering processes, enhancing production efficiency
Robust construction to withstand harsh environmental conditions
Two-row design offers efficient space utilization in PCB layouts
User-friendly locking mechanism provides peace of mind against disconnection
Moisture Sensitive Level of MSL 1 assures reliability in various applications
Compliance with RoHS directives ensures eco-friendly usage
Extensive testing certifications guarantee product reliability
Straightforward insertion and extraction improve installation times
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