Subtotal (1 reel of 1400 units)*
£555.00
(exc. VAT)
£666.00
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 12 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Reel(s) | Per Reel | Per unit* |
---|---|---|
1 + | £555.00 | £0.396 |
*price indicative
- RS Stock No.:
- 472-019
- Mfr. Part No.:
- 502382-0570
- Brand:
- Molex
Technical Reference
Legislation and Compliance
Product Details
- COO (Country of Origin):
- MY
The TE Connectivity Wire to board connector stands out due to its single-row vertical configuration, which ensures efficient space management on PCBs. Engineered for durability, the receptacle features a robust tin plating that enhances both performance and longevity. With a maximum current rating of 1.0A and a voltage capacity of up to 50V AC/DC, it is fully equipped to handle various signalling applications while maintaining compliance with industry standards. Additionally, its high-temperature thermoplastic construction makes it suitable for a wide operating temperature range, providing versatility in diverse environments. Designed with meticulous attention to the mating mechanism, this product guarantees a secure connection, making it an ideal choice for electronic manufacturers seeking quality and efficiency.
Designed for space-efficient PCB configurations
Robust tin plating enhances both performance and longevity
Supports a wide range of signalling applications effectively
Constructed from high-temperature thermoplastic for versatility
Ensures secure connections with precise keying mechanisms
Durability tested for up to 30 mating cycles, ensuring reliability
Optimally structured to facilitate surface mount technology
Robust tin plating enhances both performance and longevity
Supports a wide range of signalling applications effectively
Constructed from high-temperature thermoplastic for versatility
Ensures secure connections with precise keying mechanisms
Durability tested for up to 30 mating cycles, ensuring reliability
Optimally structured to facilitate surface mount technology
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