The Infineon XENSIV is the device for industrial and consumer applications, the low power 3D hall sensor with I2C interface. It uses our latest 3D Hall generation and is housed in an extremely small wafer-level package. With an 87 percent smaller footprint and 46 percent less height than previous comparable products, the sensor paves the way for new design options. Due to the small WLB-5 package and the low current consumption of 7 nA in power-down mode, the magnetic sensor is also suitable for use in applications that previously used resistor-based or optical solutions.

Power down mode with 7 nA (typ.) power consumption
Variable update frequencies and power modes
Triggering by external microcontroller possible via I2C protocol
X-Y angular measurement mode
Interrupt signal to indicate a valid measurement to the microcontroller
Pb-free (RoHS compliant) and halogen free package