onsemi PowerTrench N-Channel MOSFET, 30 A, 30 V, 8-Pin Power 33 FDMC8010
- RS Stock No.:
- 774-1187P
- Mfr. Part No.:
- FDMC8010
- Brand:
- onsemi
Subtotal 5 units (supplied on a continuous strip)*
£5.44
(exc. VAT)
£6.53
(inc. VAT)
FREE delivery for orders over £50.00
- 2,995 unit(s) ready to ship
Units | Per unit |
---|---|
5 + | £1.088 |
*price indicative
- RS Stock No.:
- 774-1187P
- Mfr. Part No.:
- FDMC8010
- Brand:
- onsemi
Select all | Attribute | Value |
---|---|---|
Brand | onsemi | |
Channel Type | N | |
Maximum Continuous Drain Current | 30 A | |
Maximum Drain Source Voltage | 30 V | |
Series | PowerTrench | |
Package Type | Power 33 | |
Mounting Type | Surface Mount | |
Pin Count | 8 | |
Maximum Drain Source Resistance | 2 mΩ | |
Channel Mode | Enhancement | |
Minimum Gate Threshold Voltage | 1.2V | |
Maximum Power Dissipation | 54 W | |
Transistor Configuration | Single | |
Maximum Gate Source Voltage | -20 V, +20 V | |
Width | 3.3mm | |
Typical Gate Charge @ Vgs | 67 nC @ 10 V | |
Length | 3.3mm | |
Number of Elements per Chip | 1 | |
Maximum Operating Temperature | +150 °C | |
Transistor Material | Si | |
Minimum Operating Temperature | -55 °C | |
Height | 0.75mm | |
Select all | ||
---|---|---|
Brand onsemi | ||
Channel Type N | ||
Maximum Continuous Drain Current 30 A | ||
Maximum Drain Source Voltage 30 V | ||
Series PowerTrench | ||
Package Type Power 33 | ||
Mounting Type Surface Mount | ||
Pin Count 8 | ||
Maximum Drain Source Resistance 2 mΩ | ||
Channel Mode Enhancement | ||
Minimum Gate Threshold Voltage 1.2V | ||
Maximum Power Dissipation 54 W | ||
Transistor Configuration Single | ||
Maximum Gate Source Voltage -20 V, +20 V | ||
Width 3.3mm | ||
Typical Gate Charge @ Vgs 67 nC @ 10 V | ||
Length 3.3mm | ||
Number of Elements per Chip 1 | ||
Maximum Operating Temperature +150 °C | ||
Transistor Material Si | ||
Minimum Operating Temperature -55 °C | ||
Height 0.75mm | ||
PowerTrench® N-Channel MOSFET, 20A to 59.9A, Fairchild Semiconductor
ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.