Infineon SIPMOS® N-Channel MOSFET, 120 mA, 600 V Depletion, 3-Pin SOT-223 BSP135H6327XTSA1

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RS Stock No.:
354-5708P
Mfr. Part No.:
BSP135H6327XTSA1
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Infineon
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Brand

Infineon

Channel Type

N

Maximum Continuous Drain Current

120 mA

Maximum Drain Source Voltage

600 V

Series

SIPMOS®

Package Type

SOT-223

Mounting Type

Surface Mount

Pin Count

3

Maximum Drain Source Resistance

60 Ω

Channel Mode

Depletion

Maximum Gate Threshold Voltage

1V

Minimum Gate Threshold Voltage

2.1V

Maximum Power Dissipation

1.8 W

Transistor Configuration

Single

Maximum Gate Source Voltage

-20 V, +20 V

Width

3.5mm

Transistor Material

Si

Number of Elements per Chip

1

Length

6.5mm

Maximum Operating Temperature

+150 °C

Typical Gate Charge @ Vgs

3.7 nC @ 5 V

Automotive Standard

AEC-Q101

Height

1.6mm

Forward Diode Voltage

1.2V

Minimum Operating Temperature

-55 °C

Infineon SIPMOS® N-Channel MOSFETs


Infineon SIPMOS® Series MOSFET, 120 mA Maximum Continuous Drain Current, 1.8W Maximum Power Dissipation - BSP135H6327XTSA1


This MOSFET is intended for efficient switching applications, known for its high voltage handling capabilities and low power consumption profile. As a single N-channel depletion mode MOSFET, it is well-suited for various electronic applications that require compact surface mount solutions. With a maximum drain-source voltage of 600V, it is a suitable choice for automotive and power management sectors prioritising efficiency and reliability.

Features & Benefits


• Utilises SIPMOS® technology for enhanced efficiency
• Supports high voltage capacities up to 600V for operational reliability
• Low power consumption rated at 120mA improves energy efficiency
• Designed for surface mount applications, providing space-saving benefits
• ESD protection rated for 1A to safeguard sensitive circuits
• Automotive qualified under AEC-Q101, conforming to industry standards

Applications


• Suitable for power management solutions in electronic devices
• Utilised in low voltage with high voltage capabilities
• Integrated in packaging for efficient thermal management
• Used in control circuits that require robust components

What are the implications of the thermal resistance values for performance?


The thermal resistance indicates the device's heat dissipation effectiveness, ensuring it operates within safe limits during continuous use. Lower thermal resistance values can enhance performance by improving heat management, particularly in high-current applications.

Can this MOSFET handle high-frequency switching applications?


Yes, it features low gate charge characteristics, enabling efficient operation in high-frequency environments, making it suitable for a variety of modern electronic applications.

What should be considered regarding installation and compatibility?


It is important to confirm that the mounting type aligns with the circuit board design to optimise performance and avoid potential thermal management or connectivity issues.

How does the maximum power dissipation impact its application?


With a maximum power dissipation of 1.8W, it is essential to ensure that usage does not exceed this limit to prevent overheating and potential failure. Appropriate thermal management is crucial in design.


MOSFET Transistors, Infineon


Infineon offers a large and comprehensive portfolio of MOSFET devices which includes the CoolMOS, OptiMOS and StrongIRFET families. They deliver best-in-class performance to bring more efficiency, power density and cost effectiveness. Designs requiring high quality and enhanced protection features benefit from AEC-Q101 industry standards Automotive qualified MOSFETs.