Nexperia N-Channel MOSFET, 500 A, 40 V, 4-Pin LFPAK88 BUK7S0R5-40HJ
- RS Stock No.:
- 243-4437P
- Mfr. Part No.:
- BUK7S0R5-40HJ
- Brand:
- Nexperia
Subtotal 1 unit (supplied on a continuous strip)*
£5.73
(exc. VAT)
£6.88
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- Plus 3,335 unit(s) shipping from 20 October 2025
- Plus 999,996,664 unit(s) shipping from 05 January 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 + | £5.73 |
*price indicative
- RS Stock No.:
- 243-4437P
- Mfr. Part No.:
- BUK7S0R5-40HJ
- Brand:
- Nexperia
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Nexperia | |
| Channel Type | N | |
| Maximum Continuous Drain Current | 500 A | |
| Maximum Drain Source Voltage | 40 V | |
| Package Type | LFPAK88 | |
| Mounting Type | Surface Mount | |
| Pin Count | 4 | |
| Number of Elements per Chip | 1 | |
Select all | ||
|---|---|---|
Brand Nexperia | ||
Channel Type N | ||
Maximum Continuous Drain Current 500 A | ||
Maximum Drain Source Voltage 40 V | ||
Package Type LFPAK88 | ||
Mounting Type Surface Mount | ||
Pin Count 4 | ||
Number of Elements per Chip 1 | ||
The Nexperia automotive qualified N-channel MOSFET using the latest Trench 9 low ohmic super junction technology, housed in a copper-clip LFPAK88 package. This product has been fully designed and qualified to meet beyond AEC-Q101 requirements delivering high performance and reliability.
-55 °C to +175 °C rating suitable for thermally demanding environments
Thin package and copper clip enables LFPAK88 to be highly efficient thermally
Increased maximum current capability and excellent current spreading
Low source inductance
Low thermal resistance Rth
Visual (AOI) soldering inspection, no need for expensive x-ray equipment
Easy solder wetting for good mechanical solder joint
Reduced cell pitch and super junction platform enables lower RDSon in the same footprint
Thin package and copper clip enables LFPAK88 to be highly efficient thermally
Increased maximum current capability and excellent current spreading
Low source inductance
Low thermal resistance Rth
Visual (AOI) soldering inspection, no need for expensive x-ray equipment
Easy solder wetting for good mechanical solder joint
Reduced cell pitch and super junction platform enables lower RDSon in the same footprint
12 V automotive systems
48 V DC/DC systems (on 12 V secondary side)
Higher power motors, lamps and solenoid control
Reverse polarity protection
Ultra high performance power switching
48 V DC/DC systems (on 12 V secondary side)
Higher power motors, lamps and solenoid control
Reverse polarity protection
Ultra high performance power switching