Nexperia Dual N-Channel MOSFET, 42 A, 40 V, 8-Pin LFPAK56D BUK9V13-40HX
- RS Stock No.:
- 240-1822P
- Mfr. Part No.:
- BUK9V13-40HX
- Brand:
- Nexperia
Bulk discount available
Subtotal 50 units (supplied on a continuous strip)*
£45.70
(exc. VAT)
£54.85
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 11 June 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 50 - 95 | £0.914 |
| 100 - 245 | £0.71 |
| 250 - 495 | £0.698 |
| 500 + | £0.586 |
*price indicative
- RS Stock No.:
- 240-1822P
- Mfr. Part No.:
- BUK9V13-40HX
- Brand:
- Nexperia
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Nexperia | |
| Channel Type | N | |
| Maximum Continuous Drain Current | 42 A | |
| Maximum Drain Source Voltage | 40 V | |
| Package Type | LFPAK56D | |
| Mounting Type | Surface Mount | |
| Pin Count | 8 | |
| Number of Elements per Chip | 2 | |
| Select all | ||
|---|---|---|
Brand Nexperia | ||
Channel Type N | ||
Maximum Continuous Drain Current 42 A | ||
Maximum Drain Source Voltage 40 V | ||
Package Type LFPAK56D | ||
Mounting Type Surface Mount | ||
Pin Count 8 | ||
Number of Elements per Chip 2 | ||
The Nexperia dual, logic level N-channel MOSFET in an LFPAK56D package (half-bridge configuration), using Trench 9 Trench MOS technology. This product has been designed and qualified to AEC-Q101.
LFPAK56D package with half-bridge configuration enables
Reduced PCB layout complexity
PCB shrinkage through reduced component footprint for 3-phase motor drive
Improved system level Rth(j-amb) due to optimized package design
Lower parasitic inductance to support higher efficiency
Footprint compatibility with LFPAK56D Dual package
Advanced AEC-Q101 grade Trench 9 silicon technology
Low power losses, high power density
Superior avalanche performance
Repetitive avalanche rated
Reduced PCB layout complexity
PCB shrinkage through reduced component footprint for 3-phase motor drive
Improved system level Rth(j-amb) due to optimized package design
Lower parasitic inductance to support higher efficiency
Footprint compatibility with LFPAK56D Dual package
Advanced AEC-Q101 grade Trench 9 silicon technology
Low power losses, high power density
Superior avalanche performance
Repetitive avalanche rated
