Infineon HEXFET N-Channel MOSFET, 140 A, 30 V, 3-Pin D2PAK IRL3803STRLPBF
- RS Stock No.:
- 217-2638P
- Mfr. Part No.:
- IRL3803STRLPBF
- Brand:
- Infineon
Bulk discount available
Subtotal 50 units (supplied on a continuous strip)*
£68.90
(exc. VAT)
£82.70
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- 90 unit(s) ready to ship
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 50 - 90 | £1.378 |
| 100 - 240 | £1.32 |
| 250 - 490 | £1.262 |
| 500 + | £1.175 |
*price indicative
- RS Stock No.:
- 217-2638P
- Mfr. Part No.:
- IRL3803STRLPBF
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Channel Type | N | |
| Maximum Continuous Drain Current | 140 A | |
| Maximum Drain Source Voltage | 30 V | |
| Package Type | D2PAK (TO-263) | |
| Series | HEXFET | |
| Mounting Type | Surface Mount | |
| Pin Count | 3 | |
| Maximum Drain Source Resistance | 9 mO | |
| Maximum Gate Threshold Voltage | 1V | |
| Number of Elements per Chip | 1 | |
Select all | ||
|---|---|---|
Brand Infineon | ||
Channel Type N | ||
Maximum Continuous Drain Current 140 A | ||
Maximum Drain Source Voltage 30 V | ||
Package Type D2PAK (TO-263) | ||
Series HEXFET | ||
Mounting Type Surface Mount | ||
Pin Count 3 | ||
Maximum Drain Source Resistance 9 mO | ||
Maximum Gate Threshold Voltage 1V | ||
Number of Elements per Chip 1 | ||
The Infineon 30V Single N-Channel IR MOSFET in a D2-Pak package.
Planar cell structure for wide Optimized for broadest availability from distribution partners
Product qualification according to JEDEC standard
Silicon optimized for applications switching below <100kHz
Industry standard surface-mount power package
High-current carrying capability package (up to 195 A, die-size dependent)
Capable of being wave-soldered
Product qualification according to JEDEC standard
Silicon optimized for applications switching below <100kHz
Industry standard surface-mount power package
High-current carrying capability package (up to 195 A, die-size dependent)
Capable of being wave-soldered
