Infineon IMLT65 SiC N-Channel MOSFET, 68 A, 650 V, 16-Pin PG-HDSOP-16 IMLT65R033M2HXTMA1
- RS Stock No.:
- 351-949
- Mfr. Part No.:
- IMLT65R033M2HXTMA1
- Brand:
- Infineon
Bulk discount available
Subtotal (1 unit)*
£10.59
(exc. VAT)
£12.71
(inc. VAT)
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- Shipping from 06 April 2026
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Units | Per unit |
|---|---|
| 1 - 9 | £10.59 |
| 10 - 99 | £9.53 |
| 100 + | £8.79 |
*price indicative
- RS Stock No.:
- 351-949
- Mfr. Part No.:
- IMLT65R033M2HXTMA1
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Channel Type | N | |
| Maximum Continuous Drain Current | 68 A | |
| Maximum Drain Source Voltage | 650 V | |
| Series | IMLT65 | |
| Package Type | PG-HDSOP-16 | |
| Mounting Type | Surface Mount | |
| Pin Count | 16 | |
| Channel Mode | Enhancement | |
| Transistor Material | SiC | |
| Number of Elements per Chip | 1 | |
Select all | ||
|---|---|---|
Brand Infineon | ||
Channel Type N | ||
Maximum Continuous Drain Current 68 A | ||
Maximum Drain Source Voltage 650 V | ||
Series IMLT65 | ||
Package Type PG-HDSOP-16 | ||
Mounting Type Surface Mount | ||
Pin Count 16 | ||
Channel Mode Enhancement | ||
Transistor Material SiC | ||
Number of Elements per Chip 1 | ||
- COO (Country of Origin):
- MY
The Infineon CoolSiC MOSFET discrete Generation 2 (G2) in TOLT leverages the G2 best-in-class switching performance while enabling all the benefits of top-side cooling. Complementing the Q-DPAK package, it is now possible to implement a total discrete top-side cooling solution, obtaining better thermal performance, system cost reduction and simplification, and a cheaper assembly.
Enables BOM savings
Highest reliability
Enables top efficiency and power density
Simplifies assembly and cooling
Liquid cooling ready
Allows designs without fan or heatsink
Lower stray inductances
Better gate control
Highest reliability
Enables top efficiency and power density
Simplifies assembly and cooling
Liquid cooling ready
Allows designs without fan or heatsink
Lower stray inductances
Better gate control
