STMicroelectronics HB Series Dual P-Channel MOSFET, 83 A, 650 V Depletion, 9-Pin ACEPACK SMIT STGSH80HB65DAG
- RS Stock No.:
- 152-183P
- Mfr. Part No.:
- STGSH80HB65DAG
- Brand:
- STMicroelectronics
Bulk discount available
Subtotal 10 units (supplied on a continuous strip)*
£258.00
(exc. VAT)
£309.60
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 30 January 2026
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Units | Per unit |
|---|---|
| 10 - 99 | £25.80 |
| 100 + | £23.79 |
*price indicative
- RS Stock No.:
- 152-183P
- Mfr. Part No.:
- STGSH80HB65DAG
- Brand:
- STMicroelectronics
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Channel Type | P | |
| Maximum Continuous Drain Current | 83 A | |
| Maximum Drain Source Voltage | 650 V | |
| Package Type | ACEPACK SMIT | |
| Series | HB Series | |
| Mounting Type | Surface Mount | |
| Pin Count | 9 | |
| Channel Mode | Depletion | |
| Number of Elements per Chip | 2 | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Channel Type P | ||
Maximum Continuous Drain Current 83 A | ||
Maximum Drain Source Voltage 650 V | ||
Package Type ACEPACK SMIT | ||
Series HB Series | ||
Mounting Type Surface Mount | ||
Pin Count 9 | ||
Channel Mode Depletion | ||
Number of Elements per Chip 2 | ||
- COO (Country of Origin):
- CN
The STMicroelectronics device combines two IGBTs and diodes in half-bridge topology mounted on a very compact and rugged easily surface-mounted package. The device is part of the HB series IGBTs, which is optimized both in conduction and switching losses for soft commutation. A freewheeling diode with a low drop forward voltage is included in every switch.
AQG 324 qualified
High-speed switching series
Minimized tail current
Tight parameter distribution
Low thermal resistance thanks to DBC substrate
High-speed switching series
Minimized tail current
Tight parameter distribution
Low thermal resistance thanks to DBC substrate
