TDK 10 μF Multilayer Ceramic Capacitor, 25V dc, ±10 %, Surface Mount Surface Mount

Bulk discount available

Subtotal (1 pack of 20 units)*

£4.56

(exc. VAT)

£5.48

(inc. VAT)

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Last RS stock
  • Final 520 unit(s), ready to ship

Units
Per unit
Per Pack*
20 - 80£0.228£4.56
100 - 180£0.148£2.96
200 - 480£0.137£2.74
500 - 980£0.126£2.52
1000 +£0.114£2.28

*price indicative

Packaging Options:
RS Stock No.:
915-9299
Mfr. Part No.:
C2012X5R1E106K085AC
Brand:
TDK
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Brand

TDK

Capacitance

10μF

Product Type

Multilayer Ceramic Capacitor

Voltage

25V dc

Mount Type

Surface Mount

Dielectric

X5R

Tolerance

±10 %

Minimum Operating Temperature

-55°C

Termination Type

Surface Mount

Height

0.85mm

Length

2mm

Maximum Operating Temperature

85°C

TDK C Type 0805 Series, X5R Dielectric


TDK C Series of general purpose multilayer ceramic chip capacitors suited for high frequency and high density type power suppliers.

Features and Benefits:


High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layers

A monolithic structure ensures superior mechanical strength and reliability

Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values

Low self-heating and high ripple resistance due to low ESR

Applications


Commercial Grade for general applications including

General electronic equipment; Mobile communication equipment; Power supply circuit; Office automation equipment; TV, LED displays; Servers, PCs, Notebooks, Tablets

0805 Range


Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.

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