Samsung Electro-Mechanics 10 μF Multilayer Ceramic Capacitor, 50 V dc, ± 10%, Surface Mount
- RS Stock No.:
- 766-5639
- Mfr. Part No.:
- CL21A106KOQNNNG
- Brand:
- Samsung Electro-Mechanics
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- RS Stock No.:
- 766-5639
- Mfr. Part No.:
- CL21A106KOQNNNG
- Brand:
- Samsung Electro-Mechanics
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samsung Electro-Mechanics | |
| Product Type | Multilayer Ceramic Capacitor | |
| Capacitance | 10μF | |
| Voltage | 50 V dc | |
| Package/Case | 0805 | |
| Construction | Multi-layer Ceramic Chip | |
| Mount Type | Surface Mount | |
| Dielectric | X5R | |
| Tolerance | ± 10% | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Surface Mount | |
| Series | CL | |
| Length | 2mm | |
| Height | 1.25mm | |
| Standards/Approvals | RoHS | |
| Width | 1.25 mm | |
| Maximum Operating Temperature | 85°C | |
| Select all | ||
|---|---|---|
Brand Samsung Electro-Mechanics | ||
Product Type Multilayer Ceramic Capacitor | ||
Capacitance 10μF | ||
Voltage 50 V dc | ||
Package/Case 0805 | ||
Construction Multi-layer Ceramic Chip | ||
Mount Type Surface Mount | ||
Dielectric X5R | ||
Tolerance ± 10% | ||
Minimum Operating Temperature -55°C | ||
Termination Type Surface Mount | ||
Series CL | ||
Length 2mm | ||
Height 1.25mm | ||
Standards/Approvals RoHS | ||
Width 1.25 mm | ||
Maximum Operating Temperature 85°C | ||
Samsung 0805 C0G/X5R MLCC series reels
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.