TDK 4.7 μF Multilayer Ceramic Capacitor, 50V dc, ±10 %, Surface
- RS Stock No.:
- 242-7486P
- Mfr. Part No.:
- CGA4J1X7R1H475K125AE
- Brand:
- TDK
Bulk discount available
View bulk pricing optionsSubtotal 10 units (supplied on a continuous strip)*
£2.92
(exc. VAT)
£3.50
(inc. VAT)
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In Stock
- 1,330 unit(s) ready to ship
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Units | Per unit |
|---|---|
| 10 - 20 | £0.292 |
| 25 - 45 | £0.266 |
| 50 + | £0.244 |
*price indicative
- RS Stock No.:
- 242-7486P
- Mfr. Part No.:
- CGA4J1X7R1H475K125AE
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Capacitance | 4.7μF | |
| Product Type | Multilayer Ceramic Capacitor | |
| Voltage | 50V dc | |
| Package/Case | 0805 | |
| Construction | Stacked | |
| Packaging | Tape & Reel | |
| Mount Type | Surface | |
| Dielectric | X5R | |
| Tolerance | ±10 % | |
| Automotive Standard | AEC-Q200 | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Series | CGA | |
| Length | 2mm | |
| Height | 1.25mm | |
| Width | 1.25mm | |
| Standards/Approvals | RoHS, REACH | |
| Maximum Operating Temperature | 125°C | |
| Select all | ||
|---|---|---|
Brand TDK | ||
Capacitance 4.7μF | ||
Product Type Multilayer Ceramic Capacitor | ||
Voltage 50V dc | ||
Package/Case 0805 | ||
Construction Stacked | ||
Packaging Tape & Reel | ||
Mount Type Surface | ||
Dielectric X5R | ||
Tolerance ±10 % | ||
Automotive Standard AEC-Q200 | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Series CGA | ||
Length 2mm | ||
Height 1.25mm | ||
Width 1.25mm | ||
Standards/Approvals RoHS, REACH | ||
Maximum Operating Temperature 125°C | ||
The TDK soft termination CGA series, automotive grade of TDK's multilayer ceramic chip capacitor, is a product incorporating a conductive resin layer into the terminal electrodes. The resin layer protects the ceramic body from cracks by relieving stress caused by thermal shock and board flexure. It is used in applications such as fail safe design for battery line, prevention of ceramic element crack by board bending, prevention of solder crack by thermal shock, equipment such as mobile devices and smart key having a high possibility of drop.
High resistance to mechanical stress and thermal shock by resin layers
X8R and X8L type whose maximum temperature are up to 150 degree Celsius are available
C0G type having excellent stable temperature and DC-bias characteristics is also available
AEC-Q20