TDK 1 μF Multilayer Ceramic Capacitor, 250V dc, ±10 %, Surface Mount
- RS Stock No.:
- 183-5873
- Mfr. Part No.:
- C4532X7T2E105K250KE
- Brand:
- TDK
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 183-5873
- Mfr. Part No.:
- C4532X7T2E105K250KE
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Product Type | Multilayer Ceramic Capacitor | |
| Capacitance | 1μF | |
| Voltage | 250V dc | |
| Package/Case | 1812 | |
| Mount Type | Surface Mount | |
| Packaging | Tape & Reel | |
| Dielectric | X7T | |
| Tolerance | ±10 % | |
| Automotive Standard | No | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Series | C | |
| Length | 4.5mm | |
| Width | 3.2mm | |
| Height | 2.5mm | |
| Standards/Approvals | No | |
| Maximum Operating Temperature | 125°C | |
| Select all | ||
|---|---|---|
Brand TDK | ||
Product Type Multilayer Ceramic Capacitor | ||
Capacitance 1μF | ||
Voltage 250V dc | ||
Package/Case 1812 | ||
Mount Type Surface Mount | ||
Packaging Tape & Reel | ||
Dielectric X7T | ||
Tolerance ±10 % | ||
Automotive Standard No | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Series C | ||
Length 4.5mm | ||
Width 3.2mm | ||
Height 2.5mm | ||
Standards/Approvals No | ||
Maximum Operating Temperature 125°C | ||
TDK multilayer ceramic chip capacitor Soft termination General grade C series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall.