TDK 470nF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±10% , SMD
- RS Stock No.:
- 179-4896
- Mfr. Part No.:
- CGA3E3X7R1H474K080AE
- Brand:
- TDK
Bulk discount available
Subtotal (1 reel of 4000 units)*
£324.00
(exc. VAT)
£388.00
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- 8,000 unit(s) shipping from 12 December 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Reel* |
|---|---|---|
| 4000 - 4000 | £0.081 | £324.00 |
| 8000 - 8000 | £0.078 | £312.00 |
| 12000 + | £0.075 | £300.00 |
*price indicative
- RS Stock No.:
- 179-4896
- Mfr. Part No.:
- CGA3E3X7R1H474K080AE
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Capacitance | 470nF | |
| Voltage | 50V dc | |
| Package/Case | 0603 (1608M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X7R | |
| Tolerance | ±10% | |
| Dimensions | 1.6 x 0.8 x 0.8mm | |
| Automotive Standard | AEC-Q200 | |
| Length | 1.6mm | |
| Depth | 0.8mm | |
| Height | 0.8mm | |
| Series | CGA | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +125°C | |
| Suppression Class | Class 2 | |
Select all | ||
|---|---|---|
Brand TDK | ||
Capacitance 470nF | ||
Voltage 50V dc | ||
Package/Case 0603 (1608M) | ||
Mounting Type Surface Mount | ||
Dielectric X7R | ||
Tolerance ±10% | ||
Dimensions 1.6 x 0.8 x 0.8mm | ||
Automotive Standard AEC-Q200 | ||
Length 1.6mm | ||
Depth 0.8mm | ||
Height 0.8mm | ||
Series CGA | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +125°C | ||
Suppression Class Class 2 | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor_Soft termination_Automotive grade_CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
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