TE Connectivity 0.8 mm Pitch 144 Way, Right Angle Board Mount DIMM Socket ,3.3 V

Subtotal (1 pack of 25 units)*

£165.88

(exc. VAT)

£199.06

(inc. VAT)

Add to Basket
Select or type quantity
Orders below £50.00 (exc. VAT) cost £6.95.
Temporarily out of stock
  • Shipping from 10 March 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Pack(s)
Per Pack
Per unit*
1 +£165.88£6.635

*price indicative

RS Stock No.:
481-630
Distrelec Article No.:
304-59-678
Mfr. Part No.:
390111-1
Brand:
TE Connectivity
Find similar products by selecting one or more attributes.
Select all

Brand

TE Connectivity

Memory Socket Type

DIMM

Product Type

DIMM Socket

Orientation

Right Angle

Insertion/Removal Method

Cam-In

Contact Material

Copper Alloy

Contact Plating

Gold

Number of Contacts

144

Pitch

0.8mm

Mount Type

Board

Housing Material

High Temperature Plastic

Termination Type

Surface Mount

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Row Spacing

6.2mm

Standards/Approvals

UL 94 V-0

Series

AMPMETRIMATE

Voltage

3.3 V

COO (Country of Origin):
CN
The TE Connectivity Socket is designed with versatility and performance at its core, suitable for various applications requiring precise memory connectivity. Featuring a 5.6 mm stack height, this right-angle module orientation ensures easy integration into compact designs without sacrificing space or functionality. The 144-position layout allows for robust connectivity, catering to a wide range of user needs while maintaining a high signal integrity even in demanding environments. Engineered from high-temperature plastic, this product promises durability, making it ideal for diverse operational conditions. Furthermore, compliance with industry standards like UL 94V-0 affirms its reliability in critical applications, granting peace of mind to manufacturers and design engineers alike. With this component, enhance your memory architecture while ensuring efficient performance and longevity.

Robust 144-position configuration facilitates extensive connectivity options

High-temperature plastic housing guarantees resilience in challenging environments

Right-angle module orientation allows for space-efficient designs

Optimised for 3.3V SGRAM applications ensuring compatibility with modern memory technologies

Gold-plated contact areas enhance conductivity and reduce signal loss

Surface mount termination method simplifies assembly processes

Low halogen content ensures compliance with environmental standards

Cam-in insertion style enhances reliability during the mating cycle

Related links