Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, SOP to DIP
- RS Stock No.:
- 741-9442
- Mfr. Part No.:
- W9521RC
- Brand:
- Winslow
Image representative of range
Bulk discount available
Subtotal (1 unit)*
£38.63
(exc. VAT)
£46.36
(inc. VAT)
FREE delivery for orders over £60.00
In Stock
- Plus 9 unit(s) shipping from 26 May 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 24 | £38.63 |
| 25 - 74 | £34.76 |
| 75 - 199 | £30.90 |
| 200 - 399 | £27.04 |
| 400 + | £25.11 |
*price indicative
- RS Stock No.:
- 741-9442
- Mfr. Part No.:
- W9521RC
- Brand:
- Winslow
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | SOP | |
| Connection Gender A | Female | |
| Number of Contacts A | 44 | |
| Connection Gender B | Male | |
| Number of Contacts B | 44 | |
| Contact Plating | Tin over Nickel | |
| Connection B | DIP | |
| Pitch | 2.54mm | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Brass | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A SOP | ||
Connection Gender A Female | ||
Number of Contacts A 44 | ||
Connection Gender B Male | ||
Number of Contacts B 44 | ||
Contact Plating Tin over Nickel | ||
Connection B DIP | ||
Pitch 2.54mm | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Brass | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOIC to DIP Sockets
Adaptics’ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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