Winslow Straight 1.27 mm, 15.24 mm Pitch IC Socket Adapter, 28 Pin Male DIP to 32 Pin Female PLCC
- RS Stock No.:
- 341-3358
- Mfr. Part No.:
- W9393
- Brand:
- Winslow
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Bulk discount available
Subtotal (1 unit)*
£68.79
(exc. VAT)
£82.55
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- 1 unit(s) ready to ship
- Plus 999,999,998 unit(s) shipping from 04 December 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
---|---|
1 - 24 | £68.79 |
25 - 74 | £61.91 |
75 - 199 | £55.03 |
200 - 399 | £48.14 |
400 + | £44.70 |
*price indicative
- RS Stock No.:
- 341-3358
- Mfr. Part No.:
- W9393
- Brand:
- Winslow
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Winslow | |
Pitch | 1.27 mm, 15.24 mm | |
End 1 | 28 Pin Male DIP | |
End 2 | 32 Pin Female PLCC | |
End 1 Number of Contacts | 28 | |
End 2 Number of Contacts | 32 | |
End 1 Type | DIP | |
End 2 Type | PLCC | |
End 1 Gender | Male | |
End 2 Gender | Female | |
Body Orientation | Straight | |
Select all | ||
---|---|---|
Brand Winslow | ||
Pitch 1.27 mm, 15.24 mm | ||
End 1 28 Pin Male DIP | ||
End 2 32 Pin Female PLCC | ||
End 1 Number of Contacts 28 | ||
End 2 Number of Contacts 32 | ||
End 1 Type DIP | ||
End 2 Type PLCC | ||
End 1 Gender Male | ||
End 2 Gender Female | ||
Body Orientation Straight | ||
Non Compliant
- COO (Country of Origin):
- GB
DIP to PLCC Plug Conversion
DIP to PLCC Adaptics for surface mount applications
DIP standard package sockets convert through to PLCC surface mount footprints
Heights above PCB:- total 17mm, PCB to bottom of DIP socket, 11mm
PCB: Epoxy Fibreglass FR4
DIP standard package sockets convert through to PLCC surface mount footprints
Heights above PCB:- total 17mm, PCB to bottom of DIP socket, 11mm
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
Related links
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