AAVID THERMALLOY Heatsink, Power Semiconductors, 1.55°C/W 75 mm 100 mm 40 mm
- RS Stock No.:
- 712-4386
- Mfr. Part No.:
- 0S517/150/B
- Brand:
- AAVID THERMALLOY
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Subtotal (1 unit)*
£20.54
(exc. VAT)
£24.65
(inc. VAT)
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Temporarily out of stock
- 100 unit(s) shipping from 18 March 2026
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Units | Per unit |
|---|---|
| 1 + | £20.54 |
*price indicative
- RS Stock No.:
- 712-4386
- Mfr. Part No.:
- 0S517/150/B
- Brand:
- AAVID THERMALLOY
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | AAVID THERMALLOY | |
| For Use With | Power Semiconductors | |
| Product Type | Heatsink | |
| Length | 100mm | |
| Width | 40 mm | |
| Height | 75mm | |
| Fastening | Clip | |
| Thermal Resistance | 1.55°C/W | |
| Colour | Black Anodised | |
| Finish | Black Anodised | |
| Compatible Package Type | TO-0247, D61, TO-218, TO-220, TO-247J | |
| Standards/Approvals | U.S. Patent 5.991.151 | |
| Material | Special Spring Steel, Nickel Plated | |
| Application | Cooling | |
| Special Features | Corrosion Resistance, Easy Assembly/disassembly, Reduced Fin Configuration, Patented, Even Pressure Distribution, High Elasticity | |
| Select all | ||
|---|---|---|
Brand AAVID THERMALLOY | ||
For Use With Power Semiconductors | ||
Product Type Heatsink | ||
Length 100mm | ||
Width 40 mm | ||
Height 75mm | ||
Fastening Clip | ||
Thermal Resistance 1.55°C/W | ||
Colour Black Anodised | ||
Finish Black Anodised | ||
Compatible Package Type TO-0247, D61, TO-218, TO-220, TO-247J | ||
Standards/Approvals U.S. Patent 5.991.151 | ||
Material Special Spring Steel, Nickel Plated | ||
Application Cooling | ||
Special Features Corrosion Resistance, Easy Assembly/disassembly, Reduced Fin Configuration, Patented, Even Pressure Distribution, High Elasticity | ||
The Max Clip System™ OS517 Profile
Clip mounting technology offers high reliability
Economic and manufacturing benefits that replace rivets and screws
Simplified and rapid assembly for mounting a semiconductor to the heatsink
Improved performance with the use of special thermal interface materials
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