Kontakt Chemie 82009 Novolack Etching Chemical for Etching

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RS Stock No.:
173-886
Distrelec Article No.:
303-08-576
Mfr. Part No.:
82009
Brand:
Kontakt Chemie
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Brand

Kontakt Chemie

Process Type

Etching

Product Type

Etching Chemical

Dispenser Type

Spray

Material

Novolack

Standards/Approvals

RoHS

COO (Country of Origin):
BE

CRC Etching Chemical, Liquid Ferric Chloride Form, Novolack - 82009


This etching chemical is a liquid photo-positive resist designed for use in PCB production. Made from a composition of Novolack and O-Naphto-Chinon-Diazide, it effectively transfers patterns onto various substrates. The sensitive formulation allows for high precision in chemical etching processes, ensuring that electrical circuits remain intact after application.

Features & Benefits


• Resists strong acidic etching while allowing easy removal

• Maximum photo-sensitivity in the UV-A wavelength range

• Designed for application in dark or yellow light settings

• Suitable for both metal and glass lithographic projects

• Ensures accurate pattern transfer on circuit boards

• Enables effective etching of copper and brass materials

Applications


• Utilised for printed circuit board production

• Applied in photo-lithographic processes on metals

• Suitable for glass etching

• Used in creating durable inscriptions or graphics

How should surfaces be prepared before application?


Surfaces must be cleaned of grease and oxides, ideally using a water-based cleaning process, with final rinses in deionised water to ensure full wettability.

What is the recommended drying process after coating?


Post-coating, boards should be dried in the dark, with temperatures gradually raised to 70°C and maintained for 15 minutes to ensure optimal film quality.

How is the developing process carried out after exposure?


The exposed plate should be immersed in a sodium hydroxide bath for approximately 60 seconds to dissolve the exposed lacquer, followed by thorough rinsing in water.

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