Kontakt Chemie 82009 Novolack Etching Chemical for Etching
- RS Stock No.:
- 173-886
- Distrelec Article No.:
- 303-08-576
- Mfr. Part No.:
- 82009
- Brand:
- Kontakt Chemie
Subtotal (1 unit)*
£35.12
(exc. VAT)
£42.14
(inc. VAT)
FREE delivery for orders over £60.00
Temporarily out of stock
- 6 unit(s) shipping from 04 June 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 + | £35.12 |
*price indicative
- RS Stock No.:
- 173-886
- Distrelec Article No.:
- 303-08-576
- Mfr. Part No.:
- 82009
- Brand:
- Kontakt Chemie
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Kontakt Chemie | |
| Product Type | Etching Chemical | |
| Process Type | Etching | |
| Dispenser Type | Spray | |
| Material | Novolack | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand Kontakt Chemie | ||
Product Type Etching Chemical | ||
Process Type Etching | ||
Dispenser Type Spray | ||
Material Novolack | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- BE
CRC Etching Chemical, Liquid Ferric Chloride Form, Novolack - 82009
This etching chemical is a liquid photo-positive resist designed for use in PCB production. Made from a composition of Novolack and O-Naphto-Chinon-Diazide, it effectively transfers patterns onto various substrates. The sensitive formulation allows for high precision in chemical etching processes, ensuring that electrical circuits remain intact after application.
Features & Benefits
• Resists strong acidic etching while allowing easy removal
• Maximum photo-sensitivity in the UV-A wavelength range
• Designed for application in dark or yellow light settings
• Suitable for both metal and glass lithographic projects
• Ensures accurate pattern transfer on circuit boards
• Enables effective etching of copper and brass materials
Applications
• Utilised for printed circuit board production
• Applied in photo-lithographic processes on metals
• Suitable for glass etching
• Used in creating durable inscriptions or graphics
How should surfaces be prepared before application?
Surfaces must be cleaned of grease and oxides, ideally using a water-based cleaning process, with final rinses in deionised water to ensure full wettability.
What is the recommended drying process after coating?
Post-coating, boards should be dried in the dark, with temperatures gradually raised to 70°C and maintained for 15 minutes to ensure optimal film quality.
How is the developing process carried out after exposure?
The exposed plate should be immersed in a sodium hydroxide bath for approximately 60 seconds to dissolve the exposed lacquer, followed by thorough rinsing in water.
Related links
- Fortex 600-014 Sodium Peroxydisulfate Etching Chemical for Etching
- MG Chemicals 410-1KG Ammonium Persulphate Etching Chemical for Etching
- MG Chemicals 415-1L Ferric Chloride Etching Chemical for Etching 1L
- Fortex 5L-FERRIC Ferric Chloride Etching Chemical for Etching 5L
- Fortex 1L-MICROTRAK Ferric Chloride Processing Chemical for Etching 5L
- ZAK-M22, Etching Chemical for Coating
- Sunhayato DP-10 Silicate Etching Chemical for Developing
- RS PRO Tin Etching Chemical for Tin Plating