The HSW600 series are suitable for use where water cooling is available and space is limited. Heat is extracted internally through the cooling pipe and externally by direct mounting onto a chassis or additional water cooled heatsink, thereby reducing temperature gradient across internal insulation. Applications include semiconductor protection and inrush current limiting.

The HSW600 series has a standard beaded copper 12.7mm OD waterpipe connection and PTFE insulated flexible leads. (19/0.45mm)

Rated at 600W when mounted on 3750cm² x 3mm aluminium plate with 25°C water flowing at a rate of 2 litres per minute.