Panasonic ENW89819AYKF Bluetooth Chip 4.2
- RS Stock No.:
- 175-6933
- Mfr. Part No.:
- ENW89819AYKF
- Brand:
- Panasonic
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 175-6933
- Mfr. Part No.:
- ENW89819AYKF
- Brand:
- Panasonic
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Panasonic | |
| Bluetooth Class | Class 1 | |
| Bluetooth Version | 4.2 | |
| Maximum Output Power | 11.5dBm | |
| Receiver Sensitivity | -93dBm | |
| Dimensions | 9 x 9.5 x 1.8mm | |
| Height | 1.8mm | |
| Length | 9mm | |
| Maximum Operating Temperature | +85 °C | |
| Minimum Operating Temperature | -45 °C | |
| Width | 9.5mm | |
| Select all | ||
|---|---|---|
Brand Panasonic | ||
Bluetooth Class Class 1 | ||
Bluetooth Version 4.2 | ||
Maximum Output Power 11.5dBm | ||
Receiver Sensitivity -93dBm | ||
Dimensions 9 x 9.5 x 1.8mm | ||
Height 1.8mm | ||
Length 9mm | ||
Maximum Operating Temperature +85 °C | ||
Minimum Operating Temperature -45 °C | ||
Width 9.5mm | ||
- COO (Country of Origin):
- SK
Panasonic’s new PAN1326C2 is a Host Controlled Interface (HCI) Bluetooth® Radio Frequency (RF) module that brings Texas Instruments™ seventh generation Bluetooth core integrated circuit, the CC2564C, to an easy to use module format. The PAN1326C2 is Bluetooth 5.1 compliant and it offers best-in-class RF performance with about twice the range of other Bluetooth Low Energy (LE) solutions. Panasonic’s tiny footprint technology has produced a module of only 85.5 mm². The module is designed to accommodate PCBs pad pitch of 1.3 mm and as few as two layers for easy implementation and manufacturing. The module has been designed to be 100 percent pin-compatible with previous generations of Texas Instruments based Bluetooth HCI modules.