TE Connectivity, Z-PACK HS3 2.5mm Pitch High Speed Backplane Connector, Male, Straight, 5 Column, 6 Row, 30 Way,

Discontinued
RS Stock No.:
871-9888
Mfr. Part No.:
5120678-2
Brand:
TE Connectivity
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Brand

TE Connectivity

Backplane Connector Type

High Speed

Gender

Male

Number of Contacts

30

Number of Columns

5

Number of Rows

6

Body Orientation

Straight

Housing Material

Polyester

Pitch

2.5mm

Contact Material

Phosphor Bronze

Contact Plating

Tin

Current Rating

1.15A

Voltage Rating

250 V ac

Termination Method

Solder

Series

Z-PACK HS3

Maximum Operating Temperature

+105°C

Series Number

5120678-2

Minimum Operating Temperature

-65°C

COO (Country of Origin):
US

Z-PACK™ HS3 Connectors


The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.