TE Connectivity, Z-PACK HS3 2.5mm Pitch High Speed Backplane Connector, Female, Right Angle, 10 Column, 10 Row, 100
- RS Stock No.:
- 871-9884
- Mfr. Part No.:
- 5120790-1
- Brand:
- TE Connectivity
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 871-9884
- Mfr. Part No.:
- 5120790-1
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Backplane Connector Type | High Speed | |
| Gender | Female | |
| Number of Contacts | 100 | |
| Number of Columns | 10 | |
| Number of Rows | 10 | |
| Body Orientation | Right Angle | |
| Housing Material | Polyester | |
| Pitch | 2.5mm | |
| Contact Material | Copper Alloy | |
| Contact Plating | Tin over Nickel | |
| Current Rating | 1.15A | |
| Voltage Rating | 250 V ac | |
| Termination Method | Solder | |
| Series | Z-PACK HS3 | |
| Maximum Operating Temperature | +105°C | |
| Series Number | 5120790-1 | |
| Minimum Operating Temperature | -65°C | |
Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Backplane Connector Type High Speed | ||
Gender Female | ||
Number of Contacts 100 | ||
Number of Columns 10 | ||
Number of Rows 10 | ||
Body Orientation Right Angle | ||
Housing Material Polyester | ||
Pitch 2.5mm | ||
Contact Material Copper Alloy | ||
Contact Plating Tin over Nickel | ||
Current Rating 1.15A | ||
Voltage Rating 250 V ac | ||
Termination Method Solder | ||
Series Z-PACK HS3 | ||
Maximum Operating Temperature +105°C | ||
Series Number 5120790-1 | ||
Minimum Operating Temperature -65°C | ||
- COO (Country of Origin):
- US
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.