TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

Technical Reference
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): US
Product Details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.

Specifications
Attribute Value
Number of Contacts 4
Number of Rows 1
Body Orientation Right Angle
Pitch 2mm
Mounting Type Through Hole
Contact Material Copper Alloy
Contact Plating Gold
Current Rating 16A
Termination Method Press Fit
Series Z-PACK
Available to back order for despatch 30/12/2020
Price Each
£ 6.17
(exc. VAT)
£ 7.40
(inc. VAT)
Units
Per unit
1 - 19
£6.17
20 - 74
£5.86
75 - 299
£5.57
300 - 599
£5.29
600 +
£5.02
Packaging Options:
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