RS PRO Liquid Thermal Adhesive, 20 ml
- RS Stock No.:
- 725-9993
- Brand:
- RS PRO
Discontinued product
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Price Each
£23.33
(exc. VAT)
£28.00
(inc. VAT)
- RS Stock No.:
- 725-9993
- Brand:
- RS PRO
- COO (Country of Origin):
- CN
RS PRO Heat Sink Adhesive With Activator
Introducing the heat sink adhesive with activator from our trusted and reliable own brand RS PRO, a bonding kit perfect for the thermal coupling of electrical and electronic components, or between any surface where thermal conductivity or heat dissipation is vital. This RS PRO thermally conductive kit features an acrylic resin that flows under pressure to produce a strong bond with excellent heat dissipation, with an additional activator used to speed up the reaction. This versatile kit offers a wide operating temperature range of -50°C to +150°C and is perfect as a replacement for adhesive tapes, mechanical clips and epoxies.
Features and benefits
• Wide operating range of -50°C to +150°C, making it ideal for use with a variety of applications
• Excellent bond and adhesion strength, eliminating the need for welding techniques
• Excellent thermal conductivity even at high temperatures
• Additional activator to speed up the process
• Fast and secure curing rate
• Excellent bond and adhesion strength, eliminating the need for welding techniques
• Excellent thermal conductivity even at high temperatures
• Additional activator to speed up the process
• Fast and secure curing rate
Application
Thermal adhesives are a type of thermally conductive adhesive used to secure heat sinks and electronic components. Thermal adhesives are available in a number of mediums such as thermal paste, glue, tape and more. They work by creating a strong bond for heatsinks or electrical parts commonly via a two-part epoxy resin with thermal conductivity capabilities, drawing heat away from a device. Thermal adhesives are used in a variety of industries and applications such as:
• Heat sink bonding
• Potting/encapsulating sensors
• BGA die heat spreader interface
• Chip scale packages
• Power semiconductors
• Heat sink bonding
• Potting/encapsulating sensors
• BGA die heat spreader interface
• Chip scale packages
• Power semiconductors
How to apply
Before applying, ensure surfaces are clean and free from grease, dust and contaminants. In order to achieve an optimum strength bond, apply the activator to one of the surfaces to be joined, and apply a thin layer of the adhesive to the other and press the two components together. As the activator is only used to speed up the reaction, there is no specified ratio mix for this product.
Can this thermal adhesive be removed?
Thermal adhesives such as grease and pastes can be removed if required using a combination of a thermal adhesive remover (or high concentrate rubbing alcohol) and a lint free micro fibre cloth. Please note special care must be taken when removing thermal compounds and protective clothing must be worn at all times.
What is the maximum operating temperature?
The maximum operating temperature of this thermally conductive sealant is +150°C.
Standards
RoHs Compliant
Attribute | Value |
|---|---|
| Adhesive Type | Thermal Adhesive |
| Application | Thermal Management |
| Material Compatibility | Metal, Plastic |
| Product Form | Liquid |
| Package Type | Syringe |
| Package Size | 20 ml |
| Cure Time | 5 → 10 min |
| Maximum Operating Temperature | +150°C |
| Special Features | Excellent Thermal Conductivity |
| Chemical Composition | Heptane, Methylcyclohexane, Propan-1-ol, Pyridine |
| Operating Temperature Range | -50 → +150 °C |
| Odour | Hydrocarbons |
| Minimum Operating Temperature | -50°C |