Loctite Loctite 315 + 7386 Paste Thermal Adhesive, 18 ml, 25 ml
- RS Stock No.:
- 495-228
- Mfr. Part No.:
- 142501
- Brand:
- Loctite
Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 495-228
- Mfr. Part No.:
- 142501
- Brand:
- Loctite
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Loctite | |
Adhesive Type | Thermal Adhesive | |
Trade Name | Loctite 315 + 7386 | |
Application | Thermal Management | |
Material Compatibility | Metal, Plastic | |
Colour | Blue | |
Acrylic Type | Acrylic | |
Product Form | Paste | |
Package Type | Bottle, Syringe | |
Package Size | 18 ml, 25 ml | |
Cure Time | 72 h | |
Viscosity Measurement | 320 → 850Pa/s | |
Viscosity Description | Brookfield, Helipath | |
Maximum Operating Temperature | +150°C | |
Minimum Operating Temperature | -55°C | |
Operating Temperature Range | -55 → +150 °C | |
Chemical Composition | Acrylic | |
Select all | ||
---|---|---|
Brand Loctite | ||
Adhesive Type Thermal Adhesive | ||
Trade Name Loctite 315 + 7386 | ||
Application Thermal Management | ||
Material Compatibility Metal, Plastic | ||
Colour Blue | ||
Acrylic Type Acrylic | ||
Product Form Paste | ||
Package Type Bottle, Syringe | ||
Package Size 18 ml, 25 ml | ||
Cure Time 72 h | ||
Viscosity Measurement 320 → 850Pa/s | ||
Viscosity Description Brookfield, Helipath | ||
Maximum Operating Temperature +150°C | ||
Minimum Operating Temperature -55°C | ||
Operating Temperature Range -55 → +150 °C | ||
Chemical Composition Acrylic | ||
- COO (Country of Origin):
- BE
Loctite Thermally Conductive Adhesive Kit
The Loctite thermally conductive adhesive kit is a bonding kit perfect for the thermal coupling of electrical and electronic components, or between any surface where thermal conductivity or heat dissipation is vital. This thermally conductive kit features a 1-part self-shimming thermally conductive adhesive, with an additional activator used to speed up the reaction. the self-shimming properties to ensure a controlled electrical insulation whilst maintaining thermal conductivity. This versatile kit offers a wide operating temperature range of -55°C to +150°C and is perfect as a replacement for adhesive tapes, mechanical clips and epoxies.
Features and benefits
• Adhesive with syringe for easy application
• Activator to enhance the curing process
• Wide operating range of -55°C to +150°C, making it ideal for use with a variety of applications
• Excellent bond and adhesion strength, eliminating the need for welding techniques
• Excellent thermal conductivity even at high temperatures
• Additional activator to speed up the process
• Fast and secure curing rate
• Thermal conductivity of 0.815W/mK
• Self-shimming properties produce a consistent 0.15mm (0.006in.) gap to ensure controlled electrical insulation between bonded components
• Activator to enhance the curing process
• Wide operating range of -55°C to +150°C, making it ideal for use with a variety of applications
• Excellent bond and adhesion strength, eliminating the need for welding techniques
• Excellent thermal conductivity even at high temperatures
• Additional activator to speed up the process
• Fast and secure curing rate
• Thermal conductivity of 0.815W/mK
• Self-shimming properties produce a consistent 0.15mm (0.006in.) gap to ensure controlled electrical insulation between bonded components
Application
Thermal adhesives are a type of thermally conductive adhesive used to secure heat sinks and electronic components. Thermal adhesives are available in a number of mediums such as thermal paste, glue, tape and more. They work by creating a strong bond for heatsinks or electrical parts commonly via a two-part epoxy resin with thermal conductivity capabilities, drawing heat away from a device. Thermal adhesives are used in a variety of industries and applications such as:
• Heat sink bonding
• Potting/encapsulating sensors
• BGA die heat spreader interface
• Chip scale packages
• Power semiconductors
• Heat sink bonding
• Potting/encapsulating sensors
• BGA die heat spreader interface
• Chip scale packages
• Power semiconductors
What is included?
This kit from Loctite includes an adhesive syringe applicator, with an additional activator to enhance the process.
How to apply
Before applying, ensure surfaces are clean and free from grease, dust and contaminants. In order to achieve an optimum strength bond, apply the activator to one of the surfaces to be joined, and apply a thin layer of the adhesive to the other and press the two components together.
Can this thermal adhesive be removed?
Thermal adhesives such as grease and pastes can be removed if required using a combination of a thermal adhesive remover (or high concentrate rubbing alcohol) and a lint free micro fibre cloth. Please note special care must be taken when removing thermal compounds and protective clothing must be worn at all times.
What is the maximum operating temperature?
The maximum operating temperature of this thermally conductive sealant is +150°C.
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