Thermal adhesives are a type of adhesive commonly used to attach a heatsink to electronic components. The glue is typically a two part epoxy resin which cures to form a strong bond. They are thermally conductive and usually electrically insulating, helping to dissipate heat from the device to prevent overheating or a breakdown. The main function of a thermal adhesive is to ensure there is no air space between which would act as a thermal insulator. It fills in the microscopic imperfections on the heatsink and device. There are a variety of thermal compound adhesives available that are ideal for eliminating the air gap under a heat sink. The most common types of thermally conductive adhesives are; thermal paste, thermal glue, thermal adhesive tape, thermal Grease and thermal Gap Pads.

Applications:

Thermal adhesives are used in a variety of industries and applications such as:

• Heat sink bonding
• Potting/encapsulating sensors
• BGA die heat spreader interface
• Chip scale packages
• Power semiconductors