TE Connectivity AMPMODU MTE Series Right Angle Through Hole PCB Header, 4 Contact(s), 2.54mm Pitch, 1 Row(s), Shrouded

The AMPMODU 0.025 [0.64] square interconnection system is an industry standard providing level III and IV thru-hole interconnections. Surface mount vertical receptacle assemblies are available to meet your level II packaging needs as process technologies evolve from wave soldering to surface mount reflow (infrared and vapor-phase) processes. AMPMODU surface mount receptacle assemblies are offered in vertical dual entry configurations. These receptacles are available in single-row and double-row configurations with a contact centerline spacing of .100 x .100 [2.54 x 2.54]. AMPMODU surface mount vertical receptacle assemblies continue to provide the proven features and benefits of their thru-hole counterparts in the AMPMODU product family. Closed-entry style housing design provides a lead-in ramp for positive mating of contacts, virtually eliminating the possibility of stubbing. The dual-beam receptacle contact design, coupled with gold plating in the contact area, provides a reliable interface. Tin plating on the solder tails also enhances solderability. The incorporation of compliant metallic hold downs on receptacle assemblies offers multiple benefits. The hold downs provide for proper lead-to- pad registration and provide retention to the PC board prior to and during processing. Used with a plated thru-hole, the hold downs are soldered during the reflow process and serve as a strain relief for the solder joints during mating/unmating.

The TE Connectivity (TE) AMPMODU MTE interconnection system is utilized in wire-to-board and wire-to-wire applications, and can be found in many types of electronic equipment including computers, copiers, commercial printers, appliances, medical equipment, and automotive controls.