onsemi, 4.3V Zener Diode 500 mW SMT 2-Pin SOD-123
- RS Stock No.:
- 184-1338
- Mfr. Part No.:
- MMSZ4687T1G
- Brand:
- onsemi
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- RS Stock No.:
- 184-1338
- Mfr. Part No.:
- MMSZ4687T1G
- Brand:
- onsemi
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | onsemi | |
| Nominal Zener Voltage | 4.3V | |
| Diode Configuration | Single | |
| Mounting Type | Surface Mount | |
| Number of Elements per Chip | 1 | |
| Maximum Power Dissipation | 500 mW | |
| Package Type | SOD-123 | |
| Zener Type | Voltage Regulator | |
| Pin Count | 2 | |
| Maximum Reverse Leakage Current | 4µA | |
| Dimensions | 2.84 x 1.8 x 1.25mm | |
| Forward Voltage | 0.9V | |
| Maximum Operating Temperature | +150 °C | |
| Forward Current | 10mA | |
| Minimum Operating Temperature | -55 °C | |
| Automotive Standard | AEC-Q101 | |
Select all | ||
|---|---|---|
Brand onsemi | ||
Nominal Zener Voltage 4.3V | ||
Diode Configuration Single | ||
Mounting Type Surface Mount | ||
Number of Elements per Chip 1 | ||
Maximum Power Dissipation 500 mW | ||
Package Type SOD-123 | ||
Zener Type Voltage Regulator | ||
Pin Count 2 | ||
Maximum Reverse Leakage Current 4µA | ||
Dimensions 2.84 x 1.8 x 1.25mm | ||
Forward Voltage 0.9V | ||
Maximum Operating Temperature +150 °C | ||
Forward Current 10mA | ||
Minimum Operating Temperature -55 °C | ||
Automotive Standard AEC-Q101 | ||
- COO (Country of Origin):
- CN
Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD-123 package.
503 mW Rating on FR-4 or FR-5 Board
Wide Zener Reverse Voltage Range - 1.8 V to 43 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
Mechanical Characteristics:
CASE: Void-free, transfer-molded, therm
Wide Zener Reverse Voltage Range - 1.8 V to 43 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
Mechanical Characteristics:
CASE: Void-free, transfer-molded, therm
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