TE Connectivity's range of AMPMODU MOD IV housings are 2.54mm centreline. These connectors and centre polarized receptacle style socket housings and are made from a black, flame retardant thermoplastic. These housings are for use in standard pressure and minimal vibration applications.

• Made from a flame-retardant thermoplastic
• Centre polarization to prevent misalignment
• Designed to be used in light pressure and minimal vibration
• Wire size from 20-32 AWG can be used
• Operating temperatures of -65°C to +105°C

• Servers
• Automotive Controls
• Gaming equipment
• Medical equipment
• Test and measurement devices
• Factory automation
• Telecommunication
• Storage
• Vending

The AMPMODU 0.025 [0.64] square interconnection system is an industry standard providing level III and IV thru-hole interconnections. Surface mount vertical receptacle assemblies are available to meet your level II packaging needs as process technologies evolve from wave soldering to surface mount reflow (infrared and vapor-phase) processes. AMPMODU surface mount receptacle assemblies are offered in vertical dual entry configurations. These receptacles are available in single-row and double-row configurations with a contact centerline spacing of .100 x .100 [2.54 x 2.54]. AMPMODU surface mount vertical receptacle assemblies continue to provide the proven features and benefits of their thru-hole counterparts in the AMPMODU product family. Closed-entry style housing design provides a lead-in ramp for positive mating of contacts, virtually eliminating the possibility of stubbing. The dual-beam receptacle contact design, coupled with gold plating in the contact area, provides a reliable interface. Tin plating on the solder tails also enhances solderability. The incorporation of compliant metallic hold downs on receptacle assemblies offers multiple benefits. The hold downs provide for proper lead-to- pad registration and provide retention to the PC board prior to and during processing. Used with a plated thru-hole, the hold downs are soldered during the reflow process and serve as a strain relief for the solder joints during mating/unmating.

2.54mm TE Connectivity AMPMODU Mod IV Range