OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our standard chips can be mounted in our SMD-packages. All devices can be characterized at 20mA, 2mA (low current) and under custom specific conditions. Most of them can be packaged tape-up and tape-down. The thermal resistance of the devices itself is about 150K/W (Kelvin/Watt), depending on chip technology a power dissipation up to 10mW can be realized.

packages: 1515
size: 3.8mm x 3.8mm x 0.9mm
view angle: 120°
substrate: AlN Ceramic
for High Power applications
technology: InGaN
soldering pads: silver plated
suitable for all SMT assembly methods

size: 3.2mm x 1.6mm x 1.2mm
circuit substrate: AIN Ceramics

Lead free solderable, soldering pads:silver
taped in 12 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible