Nexperia PUSB3AB6Z, Hex-Element ESD Protection Diode, 7-Pin DFN2111
- RS Stock No.:
- 153-0770
- Mfr. Part No.:
- PUSB3AB6Z
- Brand:
- Nexperia
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 153-0770
- Mfr. Part No.:
- PUSB3AB6Z
- Brand:
- Nexperia
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Nexperia | |
| Maximum Clamping Voltage | 6V | |
| Minimum Breakdown Voltage | 6V | |
| Mounting Type | Surface Mount | |
| Package Type | DFN2111 | |
| Maximum Reverse Stand-off Voltage | 5V | |
| Pin Count | 7 | |
| Maximum Peak Pulse Current | 7A | |
| ESD Protection | Yes | |
| Number of Elements per Chip | 6 | |
| Minimum Operating Temperature | -40 °C | |
| Maximum Operating Temperature | +85 °C | |
| Dimensions | 2.2 x 1.2 x 0.45mm | |
| Width | 1.2mm | |
| Length | 2.2mm | |
| Capacitance | 0.2pF | |
| Working Voltage | 3.3V | |
| Maximum Reverse Leakage Current | 100nA | |
| Height | 0.45mm | |
| Select all | ||
|---|---|---|
Brand Nexperia | ||
Maximum Clamping Voltage 6V | ||
Minimum Breakdown Voltage 6V | ||
Mounting Type Surface Mount | ||
Package Type DFN2111 | ||
Maximum Reverse Stand-off Voltage 5V | ||
Pin Count 7 | ||
Maximum Peak Pulse Current 7A | ||
ESD Protection Yes | ||
Number of Elements per Chip 6 | ||
Minimum Operating Temperature -40 °C | ||
Maximum Operating Temperature +85 °C | ||
Dimensions 2.2 x 1.2 x 0.45mm | ||
Width 1.2mm | ||
Length 2.2mm | ||
Capacitance 0.2pF | ||
Working Voltage 3.3V | ||
Maximum Reverse Leakage Current 100nA | ||
Height 0.45mm | ||
ESD protection for ultra high-speed interfaces, The device is designed to protect high-speed interfaces such as SuperSpeed and Hi-Speed USB combination, Secure Digital (SD) card 3.0 and Thunderbolt interfaces against ElectroStatic Discharge (ESD). The device includes six high-level ESD protection diode structures. They protect sensitive transmitters and receivers for ultra high-speed signal lines.
System-level ESD protection for USB 2.0 and USB 3.1 combination, SD card 3.0 and Thunderbolt interfaces
Supports SuperSpeed USB 3.1 at 10 Gbps
Line capacitance of only 0.15 pF for each channel
All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of ±15 kV exceeding IEC 61000-4-2, level 4
Matched 0.5 mm trace spacing
Design-friendly pass-through signal routing
Supports SuperSpeed USB 3.1 at 10 Gbps
Line capacitance of only 0.15 pF for each channel
All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of ±15 kV exceeding IEC 61000-4-2, level 4
Matched 0.5 mm trace spacing
Design-friendly pass-through signal routing