STMicroelectronics SMP2100SCMC, Bi-Directional ESD Protection Diode, 2-Pin DO-214AA
- RS Stock No.:
- 145-9650
- Mfr. Part No.:
- SMP2100SCMC
- Brand:
- STMicroelectronics
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 145-9650
- Mfr. Part No.:
- SMP2100SCMC
- Brand:
- STMicroelectronics
Specifications
Technical Reference
Legislation and Compliance
Product Details
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Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Direction Type | Bi-Directional | |
| Diode Configuration | Single | |
| Minimum Breakdown Voltage | 210V | |
| Mounting Type | Surface Mount | |
| Package Type | DO-214AA (SMB) | |
| Maximum Reverse Stand-off Voltage | 180V | |
| Pin Count | 2 | |
| Maximum Peak Pulse Current | 500A | |
| Number of Elements per Chip | 1 | |
| Minimum Operating Temperature | -40 °C | |
| Dimensions | 4.6 x 3.95 x 2.45mm | |
| Maximum Operating Temperature | +150 °C | |
| Length | 4.6mm | |
| Width | 3.95mm | |
| Height | 2.45mm | |
| Maximum Reverse Leakage Current | 5µA | |
Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Direction Type Bi-Directional | ||
Diode Configuration Single | ||
Minimum Breakdown Voltage 210V | ||
Mounting Type Surface Mount | ||
Package Type DO-214AA (SMB) | ||
Maximum Reverse Stand-off Voltage 180V | ||
Pin Count 2 | ||
Maximum Peak Pulse Current 500A | ||
Number of Elements per Chip 1 | ||
Minimum Operating Temperature -40 °C | ||
Dimensions 4.6 x 3.95 x 2.45mm | ||
Maximum Operating Temperature +150 °C | ||
Length 4.6mm | ||
Width 3.95mm | ||
Height 2.45mm | ||
Maximum Reverse Leakage Current 5µA | ||
- COO (Country of Origin):
- MA
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IEC 61000-4-2 level 4 – ±15 kV (air discharge) – ±8 kV (contact discharge), MIL STD 883H - Method 3015-8 Class 3B, Resin meets UL 94, V0, MIL-STD-750, method 2026 solder, EIA STD RS-481 and IEC 60286-3 packing, IPC 7531 footprint.
SMP0720SCMC, SMP1500SCMC and SMP2100SCMC - Complies with the following standards; Telcordia GR-1089,ITU-T K20/21/45 enhanced level, TIA-968, YD/T 950 / 993 / 1082, IEC 61000-4-5
IEC 61000-4-2 level 4 – ±15 kV (air discharge) – ±8 kV (contact discharge), MIL STD 883H - Method 3015-8 Class 3B, Resin meets UL 94, V0, MIL-STD-750, method 2026 solder, EIA STD RS-481 and IEC 60286-3 packing, IPC 7531 footprint.
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