Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

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RS Stock No.:
752-4904
Mfr. Part No.:
HF650P-0.001-01-00-20
Brand:
Bergquist
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Brand

Bergquist

Thickness

0.001in

Diameter

12.95mm

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+150°C

Material Trade Name

Hi-Flow 650P

Operating Temperature Range

-40 → +150 °C

COO (Country of Origin):
US

Hi-Flow 650P


Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad