Bergquist 3500ULM Series Self-Adhesive Thermal Interface Pad, 0.508 → 3.175mm Thick, 3.5W/m·K, Silicone

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RS Stock No.:
282-6851
Mfr. Part No.:
PAD TGP 3500ULMG
Brand:
Bergquist
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Brand

Bergquist

Thickness

0.508 → 3.175mm

Thermal Conductivity

3.5W/m·K

Material

Silicone

Self-Adhesive

Yes

Series

3500ULM

RoHS Status: Exempt

COO (Country of Origin):
US
The Bergquist n extremely soft gap filling material with a thermal conductivity of 3.5 W per m K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W per m K filler package and ultra-low modulus resin formulation. The enhanced material is well suited for high performance applications requiring extremely low assembly stress. It maintains a conformable nature that allows for excellent interfacing and wet out characteristics, even to surfaces with high roughness.

Fiberglass reinforced for shear and tear resistance
Non-fiberglass option for applications that require an additional reduction in stress

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