The Bergquist n extremely soft gap filling material rated at a thermal conductivity of 10.0 W per mK. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. It is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

High compliance
Low compression stress
Ultra low modulus