Bergquist HC3000 Series Self-Adhesive Thermal Gap Pad, 0.06in Thick, 3W/m·K, Silicone, 8 x 16 x 0.06in
- RS Stock No.:
- 282-6827
- Mfr. Part No.:
- GAP PAD TGP HC3000, 8in x 16in x 0.06
- Brand:
- Bergquist
Subtotal (1 unit)*
£120.14
(exc. VAT)
£144.17
(inc. VAT)
FREE delivery for orders over £50.00
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- Shipping from 12 January 2026
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Units | Per unit |
|---|---|
| 1 + | £120.14 |
*price indicative
- RS Stock No.:
- 282-6827
- Mfr. Part No.:
- GAP PAD TGP HC3000, 8in x 16in x 0.06
- Brand:
- Bergquist
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Bergquist | |
| Dimensions | 8 x 16 x 0.06in | |
| Thickness | 0.06in | |
| Length | 8in | |
| Width | 16in | |
| Thermal Conductivity | 3W/m·K | |
| Material | Silicone | |
| Self-Adhesive | Yes | |
| Series | HC3000 | |
| Select all | ||
|---|---|---|
Brand Bergquist | ||
Dimensions 8 x 16 x 0.06in | ||
Thickness 0.06in | ||
Length 8in | ||
Width 16in | ||
Thermal Conductivity 3W/m·K | ||
Material Silicone | ||
Self-Adhesive Yes | ||
Series HC3000 | ||
RoHS Status: Exempt
- COO (Country of Origin):
- US
The Bergquist soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W per m K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
High-compliance and low compression stress
Fiberglass reinforced for shear and tear resistance
Fiberglass reinforced for shear and tear resistance
Related links
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