Bergquist HC3000 Series Self-Adhesive Thermal Gap Pad, 0.06in Thick, 3W/m·K, Silicone, 8 x 16 x 0.06in

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RS Stock No.:
282-6827
Mfr. Part No.:
GAP PAD TGP HC3000, 8in x 16in x 0.06
Brand:
Bergquist
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Brand

Bergquist

Dimensions

8 x 16 x 0.06in

Thickness

0.06in

Length

8in

Width

16in

Thermal Conductivity

3W/m·K

Material

Silicone

Self-Adhesive

Yes

Series

HC3000

RoHS Status: Exempt

COO (Country of Origin):
US
The Bergquist soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W per m K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.

High-compliance and low compression stress
Fiberglass reinforced for shear and tear resistance

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