Bergquist TGP 3000 Series Self-Adhesive Thermal Gap Pad, 0.04 in Thick, 3 W/mK, 203 mm, 16in, Silicone
- RS Stock No.:
- 282-6768
- Mfr. Part No.:
- GAP PAD TGP 3000, 8in x 16in x 0.04
- Brand:
- Bergquist
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 282-6768
- Mfr. Part No.:
- GAP PAD TGP 3000, 8in x 16in x 0.04
- Brand:
- Bergquist
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.04in | |
| Thermal Conductivity | 3W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Silicone | |
| Length | 203mm | |
| Standards/Approvals | No | |
| Width | 16in | |
| Colour | Light Blue | |
| Series | TGP 3000 | |
| Minimum Operating Temperature | -60°C | |
| Maximum Operating Temperature | 200°C | |
| Select all | ||
|---|---|---|
Brand Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.04in | ||
Thermal Conductivity 3W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Silicone | ||
Length 203mm | ||
Standards/Approvals No | ||
Width 16in | ||
Colour Light Blue | ||
Series TGP 3000 | ||
Minimum Operating Temperature -60°C | ||
Maximum Operating Temperature 200°C | ||
RoHS Status: Exempt
The Bergquist Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material. It is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due to an all new 3 W/m-K filler package and low-modulus resin formulation. It is reinforced to enhance material handling, puncture, shear and tear resistance. It is well suited for high performance, low-stress applications that typically use fixed standoff or clip mounting. It maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and or topography.
Highly conformable
Designed for low-stress applications
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