Vishay 33μF Polymer Tantalum Capacitor 6.3V dc, T55 Series
- RS Stock No.:
- 860-3852
- Mfr. Part No.:
- T55B336M6R3C0070
- Brand:
- Vishay
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 860-3852
- Mfr. Part No.:
- T55B336M6R3C0070
- Brand:
- Vishay
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Vishay | |
| Technology | Polymer | |
| Capacitance | 33µF | |
| Voltage | 6.3V dc | |
| Mounting Type | Surface Mount | |
| Package/Case | 3528-21 | |
| Equivalent Series Resistance | 70mΩ | |
| Tolerance | ±20% | |
| Length | 3.5mm | |
| Depth | 2.8mm | |
| Height | 1.9mm | |
| Dimensions | 3.5 x 2.8 x 1.9mm | |
| Series | T55 | |
| Maximum Operating Temperature | +105°C | |
| Electrolyte Type | Solid | |
| Leakage Current | 20.7 μA | |
| Minimum Operating Temperature | -55°C | |
| Tolerance Plus | +20% | |
| Terminal Type | Surface Mount | |
| Tolerance Minus | -20% | |
Select all | ||
|---|---|---|
Brand Vishay | ||
Technology Polymer | ||
Capacitance 33µF | ||
Voltage 6.3V dc | ||
Mounting Type Surface Mount | ||
Package/Case 3528-21 | ||
Equivalent Series Resistance 70mΩ | ||
Tolerance ±20% | ||
Length 3.5mm | ||
Depth 2.8mm | ||
Height 1.9mm | ||
Dimensions 3.5 x 2.8 x 1.9mm | ||
Series T55 | ||
Maximum Operating Temperature +105°C | ||
Electrolyte Type Solid | ||
Leakage Current 20.7 μA | ||
Minimum Operating Temperature -55°C | ||
Tolerance Plus +20% | ||
Terminal Type Surface Mount | ||
Tolerance Minus -20% | ||
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets