TDK, VLS-HBX-1, 252012 Shielded Wire-wound SMD Inductor with a Metal Core, 6.8 μH ±20% Wire-Wound 0.94A Idc
- RS Stock No.:
- 181-4947
- Mfr. Part No.:
- VLS252012HBX-6R8M-1
- Brand:
- TDK
Stock information currently inaccessible
- RS Stock No.:
- 181-4947
- Mfr. Part No.:
- VLS252012HBX-6R8M-1
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Inductance | 6.8 μH | |
| Maximum DC Current | 0.94A | |
| Package/Case | 252012 | |
| Length | 2.5mm | |
| Depth | 2mm | |
| Height | 1.2mm | |
| Dimensions | 2.5 x 2 x 1.2mm | |
| Shielded | Yes | |
| Tolerance | ±20% | |
| Maximum DC Resistance | 372mΩ | |
| Series | VLS-HBX-1 | |
| Core Material | Metal | |
| Maximum Operating Temperature | +105°C | |
| Minimum Operating Temperature | -40°C | |
| Inductor Construction | Wire-Wound | |
| Select all | ||
|---|---|---|
Brand TDK | ||
Inductance 6.8 μH | ||
Maximum DC Current 0.94A | ||
Package/Case 252012 | ||
Length 2.5mm | ||
Depth 2mm | ||
Height 1.2mm | ||
Dimensions 2.5 x 2 x 1.2mm | ||
Shielded Yes | ||
Tolerance ±20% | ||
Maximum DC Resistance 372mΩ | ||
Series VLS-HBX-1 | ||
Core Material Metal | ||
Maximum Operating Temperature +105°C | ||
Minimum Operating Temperature -40°C | ||
Inductor Construction Wire-Wound | ||
- COO (Country of Origin):
- CN
Magnetic shield type wound inductor for power circuits using a metallic magnetic material.
High magnetic shield construction and compatible with high-density mounting.
Larger current was achieved by the metallic magnetic material.
APPLICATION
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices, compact power supply modules, other
Application guides: Smart phones/tablets
High magnetic shield construction and compatible with high-density mounting.
Larger current was achieved by the metallic magnetic material.
APPLICATION
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices, compact power supply modules, other
Application guides: Smart phones/tablets