Infineon’s XENSIV™ MEMS analog microphone IM73A135 sets a new performance benchmark in MEMS microphones. A best-in-class signal to noise ratio (SNR) of 73 dB and a high acoustic overload point of 135 dBSPL enable clear audio pick up of the quietest and the loudest sounds. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The IM73A135 allows designers to reach a level of high audio performance that was previously only achievable by ECMs while at the same time reaping the benefits inherent in MEMS technology.

•Ultra-low self-noise / ultra-high SNR (73 dB)
•Selectable power modes for battery critical applications (170/70 μA)
•Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
•Ultra high dynamic range and very high acoustic overload point (AOP) of 135 dBSPL
•Very tight part-to-part phase and sensitivity matching (± 1 dB)
•Flat frequency response with a very low LFRO (low frequency roll-off) of 20Hz
•Ultra-low group delay (2μs @ 1kHz)

•Crystal clear audio pick up of the quietest and the loudest sounds
•High ingress protection (IP57) at a microphone level
•Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)

•ANC Headphones
•Conference systems
•Smart speaker
•Surveillance
•Cameras