Loctite Lead Free Solder Paste, 500 g Tub
- RS Stock No.:
- 910-6790
- Mfr. Part No.:
- 2002845
- Brand:
- Loctite
Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 910-6790
- Mfr. Part No.:
- 2002845
- Brand:
- Loctite
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Loctite | |
| Lead Free | Yes | |
| Product Type | Solder Paste | |
| Package Type | Tub | |
| Package Size | 500 g | |
| Standards/Approvals | No | |
| Select all | ||
|---|---|---|
Brand Loctite | ||
Lead Free Yes | ||
Product Type Solder Paste | ||
Package Type Tub | ||
Package Size 500 g | ||
Standards/Approvals No | ||
GC 10 Lead Free Solder Paste
Loctite GC 10 solder paste is a game changer within the industry allowing users to store the paste at room temperature. GC 10 has a shelf life of a year at a temperature of 26.5°C and a month at temperatures of up to 40°C. The solder paste is temperature stable, halogen free, lead free also giving you abandon times of up to 24 hours. There are significant cost savings to this solder paste with unbeatable printability and reflow plus the removal of cold storage means immediate use of the solder paste as no that time is required. The GC 10 will deliver the shiniest Pb solder free joints providing excellent coalescence and wetting on long soak profiles. Reducing solder related defects. This is an outstanding innovative product offering users a temperature stable solder paste with significant cost savings.
FEATURES:
Store at room temperature
Maximum shelf life of one year at 26.5°C
No thaw required
Temperature stable
Halogen free
Lead free
Abandon times up to 24 hours
Stabilised print transfer efficiency
Current on line paste utilisation typically 95%
Reduction in solder related defects
Improved printing
BENFITS:
Zero halogens added, low voiding, no-clean.
Pb free providing long term stability over a wide range of temperature conditions.
Increased field application yields and on line pase utilisation.
Excellent solderability when re-flowed in air and nitrogen across a range of surface finishes
Component metallizations include immersionAg, OSP-Cu, ENIG, CuNiZn
Solder Paste - Lead Free
Approvals
IPC-TM-650, EN14582
Flux classification OLO0 to ANSI/J-STD-004 Rev.B
Flux classification OLO0 to ANSI/J-STD-004 Rev.B
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