Winbond W972GG8KB25I, SDRAM 2Gbit Surface Mount, 60-Pin WBGA
- RS Stock No.:
- 188-2858
- Mfr. Part No.:
- W972GG8KB25I
- Brand:
- Winbond
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 188-2858
- Mfr. Part No.:
- W972GG8KB25I
- Brand:
- Winbond
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winbond | |
| Memory Size | 2Gbit | |
| Organisation | 256M x 8 bit | |
| Number of Bits per Word | 8bit | |
| Number of Words | 256M | |
| Mounting Type | Surface Mount | |
| Package Type | WBGA | |
| Pin Count | 60 | |
| Dimensions | 12.6 x 8.1 x 0.6mm | |
| Height | 0.6mm | |
| Length | 12.6mm | |
| Width | 8.1mm | |
| Minimum Operating Temperature | -40 °C | |
| Minimum Operating Supply Voltage | 1.7 V | |
| Maximum Operating Temperature | +95 °C | |
| Maximum Operating Supply Voltage | 1.9 V | |
| Select all | ||
|---|---|---|
Brand Winbond | ||
Memory Size 2Gbit | ||
Organisation 256M x 8 bit | ||
Number of Bits per Word 8bit | ||
Number of Words 256M | ||
Mounting Type Surface Mount | ||
Package Type WBGA | ||
Pin Count 60 | ||
Dimensions 12.6 x 8.1 x 0.6mm | ||
Height 0.6mm | ||
Length 12.6mm | ||
Width 8.1mm | ||
Minimum Operating Temperature -40 °C | ||
Minimum Operating Supply Voltage 1.7 V | ||
Maximum Operating Temperature +95 °C | ||
Maximum Operating Supply Voltage 1.9 V | ||
Power Supply: VDD, VDDQ = 1.8 V ± 0.1 V
Double Data Rate architecture: two data transfers per clock cycle
CAS Latency: 3, 4, 5, 6 and 7
Burst Length: 4 and 8
Bi-directional, differential data strobes (DQS and DQS) are transmitted / received with data
Edge-aligned with Read data and center-aligned with Write data
DLL aligns DQ and DQS transitions with clock
Differential clock inputs (CLK and CLK)
Data masks (DM) for write data
Commands entered on each positive CLK edge, data and data mask are referenced to both edges of DQS
Posted CAS programmable additive latency supported to make command and data bus efficiency
Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
Off-Chip-Driver impedance adjustment (OCD) and On-Die-Termination (ODT) for better signal quality
Auto-precharge operation for read and write bursts
Auto Refresh and Self Refresh modes
Precharged Power Down and Active Power Down
Write Data Mask
Write Latency = Read Latency - 1 (WL = RL - 1)
Interface: SSTL_18
Packaged in WBGA 60 Ball (8x12.5 mm2), using Lead free materials.
Double Data Rate architecture: two data transfers per clock cycle
CAS Latency: 3, 4, 5, 6 and 7
Burst Length: 4 and 8
Bi-directional, differential data strobes (DQS and DQS) are transmitted / received with data
Edge-aligned with Read data and center-aligned with Write data
DLL aligns DQ and DQS transitions with clock
Differential clock inputs (CLK and CLK)
Data masks (DM) for write data
Commands entered on each positive CLK edge, data and data mask are referenced to both edges of DQS
Posted CAS programmable additive latency supported to make command and data bus efficiency
Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
Off-Chip-Driver impedance adjustment (OCD) and On-Die-Termination (ODT) for better signal quality
Auto-precharge operation for read and write bursts
Auto Refresh and Self Refresh modes
Precharged Power Down and Active Power Down
Write Data Mask
Write Latency = Read Latency - 1 (WL = RL - 1)
Interface: SSTL_18
Packaged in WBGA 60 Ball (8x12.5 mm2), using Lead free materials.
