Winbond W9812G2KB-6I, SDRAM 128Mbit Surface Mount, 166MHz, 90-Pin TFBGA
- RS Stock No.:
- 188-2821
- Mfr. Part No.:
- W9812G2KB-6I
- Brand:
- Winbond
Stock information currently inaccessible
- RS Stock No.:
- 188-2821
- Mfr. Part No.:
- W9812G2KB-6I
- Brand:
- Winbond
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winbond | |
| Memory Size | 128Mbit | |
| Organisation | 16M x 8 bit | |
| Data Rate | 166MHz | |
| Number of Bits per Word | 8bit | |
| Number of Words | 16M | |
| Mounting Type | Surface Mount | |
| Package Type | TFBGA | |
| Pin Count | 90 | |
| Dimensions | 13.05 x 8.05 x 0.6mm | |
| Height | 0.6mm | |
| Length | 13.05mm | |
| Width | 8.05mm | |
| Minimum Operating Temperature | -40 °C | |
| Maximum Operating Temperature | +85 °C | |
| Maximum Operating Supply Voltage | 3.6 V | |
| Minimum Operating Supply Voltage | 3 V | |
| Select all | ||
|---|---|---|
Brand Winbond | ||
Memory Size 128Mbit | ||
Organisation 16M x 8 bit | ||
Data Rate 166MHz | ||
Number of Bits per Word 8bit | ||
Number of Words 16M | ||
Mounting Type Surface Mount | ||
Package Type TFBGA | ||
Pin Count 90 | ||
Dimensions 13.05 x 8.05 x 0.6mm | ||
Height 0.6mm | ||
Length 13.05mm | ||
Width 8.05mm | ||
Minimum Operating Temperature -40 °C | ||
Maximum Operating Temperature +85 °C | ||
Maximum Operating Supply Voltage 3.6 V | ||
Minimum Operating Supply Voltage 3 V | ||
3.3V ± 0.3V power supply
1,048,576 words x 4 banks x 32 bits organization
Self Refresh Current: Standard and Low Power
CAS Latency: 2 & 3
Burst Length: 1, 2, 4, 8 and full page
Sequential and Interleave Burst
Byte data controlled by DQM0-3
Auto-precharge and controlled precharge
Burst read, single write operation
4K refresh cycles/64mS
Interface: LVTTL
Packaged in TFBGA 90 Ball (8 x13 mm2), using Lead free materials.
Dual-Die-Package (DDP), two pieces of 64M bits chip sealed in one package
1,048,576 words x 4 banks x 32 bits organization
Self Refresh Current: Standard and Low Power
CAS Latency: 2 & 3
Burst Length: 1, 2, 4, 8 and full page
Sequential and Interleave Burst
Byte data controlled by DQM0-3
Auto-precharge and controlled precharge
Burst read, single write operation
4K refresh cycles/64mS
Interface: LVTTL
Packaged in TFBGA 90 Ball (8 x13 mm2), using Lead free materials.
Dual-Die-Package (DDP), two pieces of 64M bits chip sealed in one package
The W9812G2KB is a 128M SDRAM and speed involving -6/-6I.
3.3V± 0.3V power supply 1,048,576 Words x 4 banks x 32 bits organization
Self Refresh Mode
CAS Latency: 2 and 3
Burst Length: 1, 2, 4, 8 and full page
Sequential and Interleave Burst
Byte Data Controlled by DQM0-3
Auto-precharge and controlled precharge
Burst read, single write operation
4K Refresh Cycles/64mS
Interface: LVTTL
Dual-Die-Package (DDP), two pieces of 64M bits chip sealed in one
Package
Self Refresh Mode
CAS Latency: 2 and 3
Burst Length: 1, 2, 4, 8 and full page
Sequential and Interleave Burst
Byte Data Controlled by DQM0-3
Auto-precharge and controlled precharge
Burst read, single write operation
4K Refresh Cycles/64mS
Interface: LVTTL
Dual-Die-Package (DDP), two pieces of 64M bits chip sealed in one
Package